Product Change Notification - SYST-09KMIJ351 Date: 10 May 2018 Product Category: Linear Regulators Affected CPNs: Notification subject: Data Sheet - MIC5501/2/3/4-300mA Single Output LDO in Small Packages Notification text: SYST-09KMIJ351 Microchip has released a new DeviceDoc for the MIC5501/2/3/4-300mA Single Output LDO in Small Packages of devices. If you are using one of these devices please read the document located at MIC5501/2/3/4-300mA Single Output LDO in Small Packages. Notification Status: Final Description of Change: 1) Converted Micrel document MIC5501/2/3/4 to Microchip data sheet DS20006006A. 2) Minor text changes throughout. Impacts to Data Sheet: None Reason for Change: To Improve Manufacturability Change Implementation Status: Complete Date Document Changes Effective: 10 May 2018 NOTE: Please be advised that this is a change to the document only the product has not been changed. Markings to Distinguish Revised from Unrevised Devices: N/A Attachment(s): MIC5501/2/3/4-300mA Single Output LDO in Small Packages Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our
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300 ma Single Output LDO in Small Packages Features General Description Applications Package Types MIC5501/2/3/4 MIC5501/4
Typical Application Circuit MIC5501/2/3/4
1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Operating Ratings Notice: Notice: Note 1: 2: TABLE 1-1: Electrical Characteristics: ELECTRICAL CHARACTERISTICS bold Parameter Symbol Min. Typ. Max. Units Conditions 3.0 3.0 0.3 190 380 55 65 Enable Input 1.2 0.2
TABLE 1-1: Electrical Characteristics: ELECTRICAL CHARACTERISTICS (CONTINUED) bold Parameter Symbol Min. Typ. Max. Units Conditions Note 1: 125 2: 3:
TEMPERATURE SPECIFICATIONS (Note 1) Temperature Ranges Parameters Sym. Min. Typ. Max. Units Conditions Package Thermal Resistances Note 1:
2.0 TYPICAL PERFORMANCE CURVES Note: FIGURE 2-1: Ratio. Power Supply Rejection FIGURE 2-4: Voltage. Ground Current vs. Supply FIGURE 2-2: Current. Dropout Voltage vs. Output FIGURE 2-5: Current. Ground Current vs. Load FIGURE 2-3: Temperature. Dropout Voltage vs. FIGURE 2-6: Temperature. Ground Current vs.
FIGURE 2-7: Current. Output Voltage vs. Output FIGURE 2-10: Voltage. Current Limit vs. Supply FIGURE 2-8: Voltage. Output Voltage vs. Supply FIGURE 2-11: Enable Turn-On. FIGURE 2-9: Temperature. Output Voltage vs. FIGURE 2-12: Enable Turn-On.
FIGURE 2-13: Load Transient. FIGURE 2-16: Auto-Discharge (No Load). FIGURE 2-14: Load Transient. FIGURE 2-15: Line Transient.
3.0 PIN DESCRIPTIONS TABLE 3-1: 4-Lead TDFN Pin Number PIN FUNCTION TABLE SOT23-5 Pin Number Pin Name Description
4.0 APPLICATION INFORMATION 4.4 Enable/Shutdown 4.1 Input Capacitor 4.5 Thermal Considerations 4.2 Output Capacitor EQUATION 4-1: P D = V IN V OUT1 I OUT + V IN I GND EQUATION 4-2: P D = 3.6V 2.8V 300mA = 0.240W 4.3 No-Load Stability EQUATION 4-3: T JMAX T A P DMAX = ------------------------------- JA
EQUATION 4-4: 0.240W = 125 C T A 250 C/W T A = 65 C
5.0 PACKAGING INFORMATION 5.1 Package Marking Information TABLE 5-1: ABBREVIATED TOP MARK Device Package Feature Output Voltage 1.0V 1.2V 1.8V 2.2V 2.5V 2.8V 3.0V 3.1V 3.3V Legend: * Note
4-Lead TDFN 1 mm x 1 mm Package Outline and Recommended Land Pattern
5-Lead SOT23 Package Outline and Recommended Land Pattern
APPENDIX A: REVISION HISTORY Revision A (April 2018)
PRODUCT IDENTIFICATION SYSTEM Device -X.X X XX -XX Examples: Device: Output Voltage: Junction Temperature Range: Package: Media Type: Note: Note 1:
Note the following details of the code protection feature on Microchip devices: Trademarks. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company s quality system processes and procedures are for its PIC MCUs and dspic DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
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SYST-09KMIJ351 - Data Sheet - MIC5501/2/3/4-300mA Single Output LDO in Small Packages Affected Catalog Part Numbers(CPN) MIC5501-1.8YMT-T5 MIC5501-1.8YMT-TR MIC5501-1.8YMT-TZ MIC5501-3.0YM5-T5 MIC5501-3.0YM5-TR MIC5501-3.0YMT-T5 MIC5501-3.0YMT-TR MIC5501-3.0YMT-TZ MIC5502-1.8YMT-T5 MIC5502-1.8YMT-TR MIC5502-1.8YMT-TZ MIC5502-2.8YMT-T5 MIC5502-2.8YMT-TR MIC5502-2.8YMT-TZ MIC5502-3.0YMT-T5 MIC5502-3.0YMT-TR MIC5502-3.0YMT-TZ MIC5503-1.2YMT-T5 MIC5503-1.2YMT-TR MIC5503-1.2YMT-TZ MIC5503-1.8YMT-T5 MIC5503-1.8YMT-TR MIC5503-1.8YMT-TZ MIC5504-1.0YMT-T5 MIC5504-1.0YMT-TR MIC5504-1.2YM5-T5 MIC5504-1.2YM5-TR MIC5504-1.2YMT-T5 MIC5504-1.2YMT-TR MIC5504-1.2YMT-TZ MIC5504-1.8YM5-T5 MIC5504-1.8YM5-TR MIC5504-1.8YMT-T5 MIC5504-1.8YMT-TR MIC5504-1.8YMT-TZ MIC5504-2.2YMT-T5 MIC5504-2.2YMT-TR MIC5504-2.2YMT-TZ MIC5504-2.5YM5-T5 MIC5504-2.5YM5-TR MIC5504-2.5YMT-T5 MIC5504-2.5YMT-TR
MIC5504-2.5YMT-TZ MIC5504-2.8YM5-T5 MIC5504-2.8YM5-TR MIC5504-2.8YMT-T5 MIC5504-2.8YMT-TR MIC5504-2.8YMT-TZ MIC5504-3.0YM5-T5 MIC5504-3.0YM5-TR MIC5504-3.0YMT-T5 MIC5504-3.0YMT-TR MIC5504-3.0YMT-TZ MIC5504-3.1YMT-T5 MIC5504-3.1YMT-TR MIC5504-3.1YMT-TZ MIC5504-3.3YM5-T5 MIC5504-3.3YM5-TR MIC5504-3.3YMT-T5 MIC5504-3.3YMT-TR MIC5504-3.3YMT-TZ