ISSM2012 Networking Session

Similar documents
ISSM2010 Networking Session

ISSM2008 Networking Session

Conference Name: MEMS Engineer Forum (MEF) 2017 Period: Wednesday, April 26 and Thursday, April 27, 2017

Exhibitor Package and Sponsorship Opportunities

REGIONAL OSTEOPATHIC CONVENTION NEW YORK 2018 ROC - NY 2018 Emerging Topics in the World of Medicine

Exhibitor and Sponsorship Information AESP's Spring Conference & Expo. Learning A La Carte AESP Conference & Solutions Center

SPONSOR / EXHIBITOR Package

EVENT SCHEDULE:* For more information visit

EXHIBITOR PROSPECTUS CONFERENCE DATES: EXHIBIT DATES: July 22-July 25. July 22-July 24. Innovating labs worldwide. The Phoenician Scottsdale, Arizona

Greetings Non-Profit Vendors,

SPONSORSHIP & EXHIBITOR PROSPECTUS

Trade Fair. Exhibition Prospectus. Hong Kong City Hall 5 Edinburgh Place Central, Hong Kong

SPONSOR / EXHIBITOR Package

Exhibitor Information

Exhibitor & Sponsor Prospectus

2017 Exhibitor Packet Austin, TX

We look forward to seeing you in Elko. Sincerely,

17th Annual Special Needs Trusts National Conference

Seminar and exhibits organized on behalf of: 1 of 7

SPONSOR/EXHIBITOR INFORMATION

Last Minute Information

Interactive Fair Prospectus. w w w.locs4africa.iclei.org. Convened by : ICLEI - Local Governments for Sustainability

SPONSORSHIP & TRADE EXHIBITION

2018 FASRO ANNUAL CONFERENCE

MAKO Conference Sponsorship Opportunities

Connect Collaborate Celebrate

NYWEA SPRING TECHNICAL CONFERENCE AND EXHIBITION June 11-13, 2018 EXHIBITION TUESDAY, JUNE 12 ONE DAY THE SAGAMORE, BOLTON LANDING, NY

EECON NSW & 26 November 2015, Australian Technology Park, Sydney. Sponsorship and Exhibition Prospectus

2018 Annual Florida Bar Convention

health, wealth & happiness British HCI 2011 Conference 4th 8th July 2011, Northumbria University, Newcastle upon Tyne, UK

PARK PERMIT APPLICATION

2016 TORONTO, ONTARIO SEPTEMBER 25-28

POLICIES & PROCEDURES

Exhibitor Packet. Schedule of Events

145 10' 151 8' 162 8' 176 8' 178 8' 186 8' 191 8' 194 8'

MOUNTAINS OF OPPORTUNITY TECHNICAL CONFERENCE & TRADE SHOW SEPTEMBER 18 TH SEPTEMBER 21 ST SUN PEAKS GRAND HOTEL & CONFERENCE CENTRE

PASBO Facilities Management/ Transportation Conference & Exhibits in Partnership with SchoolDude

ACSA NATIONAL SUMMIT. Exhibition Manual BOOK A BOOTH OR SPONSORSHIP PACKAGE TODAY. CAIRNS September.

IFEA s 61 st ANNUAL EXPO Wednesday, September 28, :00 a.m. - 7:00 p.m.

POLICIES & PROCEDURES

2017 POST SHOW REPORT. April 5-7, 2017 / Tokyo Big Sight, Japan Organised by Reed Exhibitions Japan Ltd.

EXHIBITOR GUIDE & SERVICE MANUAL

AOC AOC CONVENTION EW IO EMS CYBER. Adelaide South Australia 18 &19 August 2014

24 th Annual Food Service Conference & Exhibits November 14 & 15, 2018

Business Exhibitor Opportunities

JATA Tourism EXPO Japan 2014

EXHIBITORS' INVITATION

EUROPEAN SOCIETY FOR BIOMEDICAL RESEARCH ON ALCOHOLISM

COABE 2016 National Conference

2019 Exhibitor Packet

MARCH 27-31, Baltimore Marriott Waterfront Baltimore, Maryland

Technical Conference & Trade Show. September 17 th September 20 th Penticton Trade & Convention Centre 273 Power Street, Penticton BC V2A 7K9

11th Annual Conference

Sponsorship and Exhibition Prospectus

VENDOR APPLICATION. Festival main address for map: Plaza DeLuna 900 S Palafox Street Pensacola, FL 32502

3-5 JANUARY 2019 ICC Birmingham

Annex 5: Technical Terms and Conditions for Lot IV: Committee of the Regions

Exhibitor Service Manual Ontario Pharmacists Association Conference 2014

PASBO Facilities, Transportation & School Safety Conference & Exhibits

Why GIS-Pro 2017? No matter your company size, budget or marketing goals, there is an opportunity to maximize your visibility at GIS-Pro 2017.

Puerto Rico Convention Center August Exhibit Agreement COMPANY NAME: CONTACT PERSON: MAILING ADDRESS:

EXHIBITOR MANUAL Important:

NOTE: THERE WILL BE NO PAPER REGISTRATION, ALL REGISTRATIONS WILL BE TAKEN ON-LINE USING THE MAP-DYNAMICS WEBSITE.

NACE INTERNATIONAL 2008 NORTHERN AREA WESTERN CONFERENCE

To Administrations of Member States of the ITU

The 36th Japan Agricultural Formulation and Application Symposium

Cannabis Science Conference

Wisconsin Lakes Partnership Convention Business Exhibit Opportunities

IEEE P SIEPON Working Group

We are grateful to welcome your organisation as a partner for the Photonics North 2016 Exhibition.

Exhibitor Terms and Conditions

Fall Education Conference & Trade Show

ANNUAL MEETING & WORKSHOPS June 8-10, 2018 The Breakers Palm Beach, Florida

2016 Exhibitor Packet. Fort Worth, TX

The 6th Conference of Asia Regional Adhesive Council. The 21st China Adhesive and Tape Annual Conference

Rick Gabler Director of Marketing

PCB ANNUAL CONFERENCE

Application Guide The International Technical Exhibition of Medical Imaging 2019 ITEM 2019

Exhibitor Information

2015 CREW NETWORK MARKETPLACE EXHIBITOR GUIDE

Director, Events & Exhibit Sales

on the Job 24/7 Technical Conference & Trade Show September 20 th September 23 rd penticton trade & convention centre

12 th ANNUAL ACADEMIC SURGICAL CONGRESS

Exhibitor Prospectus. Annual Convention & Trade Show. March 30-April 3, 2010 San Diego Marriott Hotel & Marina

ESCAP/WMO Typhoon Committee Forty-ninth Annual Session of Typhoon Committee February 2017, Yokohama, JAPAN INFORMATION NOTE FOR PARTICIPANTS

ENAR. Atlanta, GA. March Hyatt Regency Atlanta on Peachtree St. SPRING MEETING With IMS & Sections of ASA SPONSOR EXHIBIT ADVERTISE PROSPECTUS

2017 POST SHOW REPORT. April 5-7, 2017 / Tokyo Big Sight, Japan Organised by Reed Exhibitions Japan Ltd.

SPONSOR/EXHIBITOR INFORMATION

ALL CITY PARKS AND TRAILS ARE SMOKE FREE AS OF APRIL

Y.E.S. Camp Youth Enjoying Summer Camp 2017 registration Form

THE MIRAGE LAS VEGAS MARCH 18 - MARCH

LA SCREENINGS 2018 INDEPENDENTS: MAY TH, 2018 STUDIO SCREENINGS: MAY rd, 2018 INTERCONTINENTAL EXHIBITING SUITE FORM

2018 JCI ASPAC Kagoshima Trade Show Exhibition. Guidelines

Wisconsin Lakes Partnership Convention Business Exhibit Opportunities

CONFERENCE SUPPORTERS PROSPECTUS

Sponsorship and Exhibition Prospectus. UCD O'Brien Centre for Science, University College Dublin, Ireland.

Letter of invitation for Tender. Ref. No.: T

DOWN TO EARTH CONFERENCE 2018 SPONSORSHIP PROSPECTUS NOVEMBER 27-28, 2018 CROWN CASINO MELBOURNE.

Member status PATA Member Chapter Member Non-member

EXHIBITOR AND SPONSORSHIP PROSPECTUS

Transcription:

ISSM2012 Networking Session Schedule: 12:00-20:00(closing time : during Keynote Speech), Monday, October 15 Place: Crystal Room, B1F, Hyatt Regency Tokyo <The Objective and Target of ISSM2012 Networking Exhibition> The ISSM Networking Session was introduced at ISSM 2006. The ISSM Networking Session, targeting to semiconductor equipment, materials, facilities, software, and IP suppliers, provides efficient opportunities to deliver your key solutions technologies to the right targeted audience of ISSM participants. The participation in general sessions of ISSM requires abstract review process by ISSM international program committees through call-for-paper submission. The ISSM assessment process is an objective, peer-judged process involving 60 evaluators from semiconductor companies and academia around the world. Only selected papers by ISSM s international program committees are presented either in oral session or interactive (poster) session. The Best Papers of ISSM have chances to be included in IEEE s Transaction on Semiconductor Manufacturing in the following year. The ISSM 2012 Program Committee acknowledges the value of implementation of commercial equipment, materials, facilities, software, and intellectual properties. They supplement academic and technology-oriented concept and bring solutions in many cases. The objective of ISSM s Networking Session is to provide an excellent opportunity to the exhibiting suppliers to present their solution or concept to all participants of ISSM in interactive atmosphere. The schedule and the venue of this session have improved offering the great opportunity to join this interactive session by appealing more audience. The venue is located just across the main conference room and the partition between the reception area and Networking Session will be removed to encourage all participants to enjoy free interaction and exchange in a relaxed atmosphere.

Booth 1. Back side Panel (W1.8mxH2.5m) The space for display is W1.5mxH1.6m 2. Table (W1.8mxD0.6m) 3. AC Power Outlet(500W)1 4. Spotlights 2 5. Company Name Board (in English and Japanese) Note 1. Exhibition Fee: JPY150,000/booth unit (tax included) 2. Program committee will not set any restriction to participate exhibition due to category of business, operation and organization as far as having relevancy to semiconductor manufacturing. 3. Program committee expects material exhibition and solution proposal along with ISSM2012 theme from every exhibitor. 4. Number of Booth Minimum: 1 booth/maximum: 2 booths 5. Closing date for application : September 14, 2012 (Fri) *We have extended the closing date. 6. Application: Fill in the attached form and send it to ISSM2012 Japan Office(E-mail to issm_2012@semiconportal.com or FAX to +81-3560-3565) by September 14, 2012. 7. Booth location segmented by interest area will be notified after review by ISSM2012 program committee. 8. Capacity of 20 booths. 9. Exhibit material should be written in both Japanese and English. 10. Exhibitors can bring products or promotion materials. Cancellation Policy Cancellation penalties will apply after the confirmation of the application is sent to the exhibitors. - 50% of total exhibit fee for cancellation after the notification by confirmation letter till September 14, 2012. - 100% of total exhibit fee for cancellation on and after September 14, 2012 Important Date September 14, 2012 : Deadline of Application

October 31, 2012 : Deadline of Booth Fee Payment 9:00, October 15, 2012 : Exhibits Move-in 20:00-21:00, October 15, 2012: Exhibits Move-Out & Booth Tear Down Shipping Instructions <Incoming Materials> IMPORTANT: Paid exhibit registration is required before making shipping arrangements with the Hyatt Regency Tokyo. The Hyatt Regency will not assume any responsibility for the damage or loss of merchandise sent to the Hyatt Regency Tokyo for storage. Exhibit materials must be shipped directly to the Hyatt Regency Tokyo. Packages must arrive no earlier than 12 October 2012. Materials that arrive earlier will not be accepted. Shipments must be addressed as follows: Hyatt Regency Tokyo 2-7-2 Nishi-Shinjuku, Shinjuku-Ku Tokyo 160-0023, Japan Tel: +81 3 3348 1234 Hold For : ISSM2012 (10/15-10/17), NETWORKING SESSION at B1F Century Room, [Contact Name] Arrival Date: [Contact Arrival Day & Date] Booth Number: [Your booth number] Exhibitors must include their return address on all box(es) shipped to the Hyatt Regency Tokyo. <Outgoing Materials> Guests can ship their packages out from the Networking Session venue (Century Room, B1F). All outgoing boxes must be packed, sealed, and labeled by the Exhibitor. The hotel will provide a shipping form that is used internally for proper tracking. Inland transport/domestic Shipment will be handled by YAMATO TRANSPORT CO., LTD. and only pay on delivery (Chakubarai) is available. Overseas shipping

Please check with ISSM2012 Japan Office separately. Shipping Questions All questions related to shipping exhibitor materials should be directed to the Hyatt Regency Tokyo before the meeting. Exhibitors are responsible for contracting for the shipment and handling of all exhibit materials. the Hyatt Regency Tokyo and Semiconductor Portal, Inc. (ISSM Japan Office) are not responsible for lost or misdirected shipments. Others Signs and Banners There is to be no rigging of signs, banners, lights, sound, etc., from any ceiling in the Hyatt Regency Tokyo without their expressed prior approval. In addition, no signs are to be taped on walls, doors, columns, or windows. No nails, hooks, screws, tacks, or adhesives may be used to secure signs or other paraphernalia. All exhibitors must observe the following rules and regulations: Wall, column, and permanent building outlets are not a part of booth space and are not to be used by exhibitors unless specified in writing by The Hyatt Regency Tokyo Engineering department. Use of open clip sockets, latex, or lamp cord wire and duplex or triplex attachment plugs in exhibits is strictly prohibited. All material and equipment furnished by the Hyatt Regency Tokyo staff shall remain the property of the hotel and can only be removed by hotel engineering personnel at the close of the function. Exhibitor is responsible for any and all damages to floor coverings and walls caused by exhibitor and/or exhibitor's employees. Security Each exhibitor must make provisions for safeguarding its materials, equipment, and displays at all times. Neither the Hyatt Regency Tokyo nor Semiconductor Portal, Inc will be responsible for the loss or theft of property belonging to any Exhibitor, its agents, employees, visitors, or guests. Each Exhibitor must carry full insurance for the entire duration of the show. Please include proof of your insurance with your registration. Exhibitors assume all responsibility for compliance with local, city, county, state, and federal ordinances and regulations covering fire, safety, and health. Only fireproof materials should be used in displays and Exhibitors should take necessary fire precautions.

Exhibitor Responsibilities In the event that any damage occurs to the Hyatt Regency Tokyo furniture, fixtures, building, or equipment caused by installation, presence, and/or removal of exhibit materials, the Exhibitor shall reimburse the Hyatt Regency Tokyo for the cost of such repair, or replacement as may be necessary. Disclaimers By registering as an Exhibitor, the Exhibitor indemnifies and agrees to hold harmless the Hyatt Regency Tokyo and Semiconductor Portal, Inc. (ISSM Japan Office) its officers, directors, employees and agents, from and against any actions, losses, costs, damages, and expenses (including attorney fees) arising from damages to property or bodily injury to the Exhibitor, his agents representatives and employees by reason of the Exhibitor's occupancy or use of the Exhibitor's facilities. Hyatt Regency Tokyo and Semiconductor Portal, Inc. (ISSM Japan Office) are not responsible for any lost, stolen, damaged or misdirected equipment, personal items or business related property brought onto the premises by an Exhibitor, guest, group contractor, etc. This includes items that are in the meeting rooms outside of the event hours. Contact ISSM Japan Office at Semiconductor Portal, Inc. E-mail: issm_2012@semiconportal.com Phone: +81-3-3560-3565 FAX: +81-3-3560-3566

Map & Directions Hyatt Regency Tokyo http://tokyo.regency.hyatt.com/ 2-7-2 Nishi-Shinjuku, Shinjuku-Ku Tokyo 160-0023, Japan Tel: +81 3 3348 1234 Fax: +81 3 3344 5575 Access to Hyatt Regency Tokyo From Narita International Airport - Airport Limousine Bus for Narita International Airport (2 hours) One-way adult fare - JPY 3000 Airport Limousine Bus for Haneda Domestic Airport (1 hour 10 minutes) One-way adult fare - JPY 1200 Visit http://www.limousinebus.co.jp for further information on timetables. Narita Express Train Service from Narita Station to Shinjuku Station (1 hour 20 minutes) One-way fare - JPY 3110 (low season), JPY 3310 (high season) * An additional taxi is required from Shinjuku Station to the hotel or it takes nine minutes to walk. Tentative ISSM2012 Program Schedule *the program schedule is subject to change AM Monday, October 15 Tuesday, October 16 Wednesday, October 18 Room 1 Room 2 Room 3 Room 1 Room 2 Room 1 Room 2 8:00 9:30 Registration Opening Remarks Registration Registration 9:50 9:40 9:40 Keynote Speech Keynote Speech 10:50 Networking 10:40 10:40 set-up Keynote Speech 11:50 Lunch 11:40 Lunch 11:40 Lunch 13:00 13:00 13:00 Invited Session Invited 13:40 Break 13:40 Break 13:50 14:00 Break 13:50 Session Invited 14:10 Session Invited 14:30 14:30 Break 14:30 14:40 14:50 Author's interview & Break 14:50 Author's interview & Break PM 15:00 Networking 15:10 Author's interview & Break 15:10 Author's interview & Break 15:20 Session 15:30 15:30 15:40 Author's interview & Break 15:50 15:50 16:10 16:10 16:10 16:30 16:30 Author's interview & Break 16:30 16:50 Author's interview & Break 16:50 3-minutes talk/interactive 17:10 Ev 17:20 Reception 17:30 Poster Session&Cocktail 17:30 Author's interview & Break 19:00 19:00

ISSM2012 Networking Session Registration Form Date of Apply Name of Organization Name Job Title Department Primary Contact Information E-mail Address Business Phone Address 1 Address 2 Zip code Country Name Job Title Secondary (back up) Contact Information Department E-mail Address Business Phone Assistant's Name Assistant's Phone Please select your exhibit size Assistant's e-mail address 1 booth 2 booths First choice: Second choice: Third choice: Please select your exhibit area (the place will be provided according to this survey) Factory Design (FD) Process Control and Monitoring (PC) Process and Metrology Equipment (PE) Final Manufacturing (FM) Please provide a brief description of display (this will be on the website) 1.Semiconductor Device Manufacturer Manufacturing Strategy and Management (MS) Process and Material Optimization (PO) Ultraclean Technology (UC) Design for Manufacturing (DM) 2.Semiconductor equipment, material Manufacture Manufacturing Control and Execution (MC) Yield Enhancement Methodology (YE) Environment, Safety and Health (ES) 3.Semiconductor Design related company 4.Trading firm 5.Academic 6.Government 7.Government researcher 8.Others